Substrate transfer chamber

ABSTRACT

Embodiments of substrate transfer apparatus are provided herein. In some embodiments, an apparatus for storing and transporting at least one substrate in a vacuum includes a carrying case for storing one or more substrates, wherein the carrying case includes a vacuum port and a plurality of holders to hold one or more substrates within an inner volume of the carrying case; and a vacuum source in fluid connection with the carrying case via the vacuum port.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. non-provisional applicationSer. No. 14/933,635, filed Nov. 5, 2015, which claims benefit of U.S.provisional patent application Ser. No. 62/078,399, filed Nov. 11, 2014,both of which are herein incorporated by reference in their entirety.

FIELD

Embodiments of the present disclosure generally relate to substrateprocessing equipment, and more specifically, methods and apparatus forhandling a substrate.

BACKGROUND

During processing of a substrate in for example, microelectronic devicefabrication, the substrate may be transferred to multiple chambers toperform various processes. The substrate is in a vacuum duringprocessing and at atmospheric pressure during transfer. Oxidation formson the substrates upon leaving the vacuum environment and returning toatmospheric pressure. As such, the substrate undergoes a degas and/orpreclean procedure to remove any oxidation prior to any furtherprocessing, resulting in processing delays.

Therefore, the inventors have provided improved methods and apparatusfor substrate transfer.

SUMMARY

Embodiments of substrate transfer chambers are provided herein. In someembodiments, a substrate transfer chamber includes a body having aninterior volume, wherein a bottom portion of the body includes a firstopening; an adapter plate coupled to the bottom portion of the body tocouple the substrate transfer chamber to a load lock chamber of asubstrate processing system; wherein the adapter plate includes a secondopening aligned with the first opening to fluidly couple the interiorvolume with an inner volume of the load lock chamber; a cassette supportdisposed in the interior volume to support a substrate cassette; and alift actuator coupled to the cassette support to lower or raise thesubstrate cassette into or out of the load lock chamber.

In some embodiments, a vacuum chamber includes a body having an interiorvolume, wherein a bottom portion of the body includes a first opening;an adapter plate coupled to the bottom portion of the body to couple thevacuum chamber to a load lock chamber of a substrate processing system;wherein the adapter plate includes a second opening aligned with thefirst opening to fluidly couple the interior volume with an inner volumeof the load lock chamber; a cassette support disposed in the interiorvolume to support a substrate cassette; and a lift actuator coupled tothe cassette support to lower or raise the substrate cassette into orout of the load lock chamber.

In some embodiments, a substrate processing system includes a centraltransfer chamber; one or more load lock chambers coupled to the centraltransfer chamber; and a substrate transfer chamber coupled to one of theone or more load lock chambers. The substrate transfer chamber includesa body having an interior volume, wherein a bottom portion of the bodyincludes a first opening; an adapter plate coupled to the bottom portionof the body to couple the substrate transfer chamber to a load lockchamber of a substrate processing system; wherein the adapter plateincludes a second opening aligned with the first opening to fluidlycouple the interior volume with an inner volume of the load lockchamber; a cassette support disposed in the interior volume to support asubstrate cassette; and a lift actuator coupled to the cassette supportto lower or raise the substrate cassette into or out of the load lockchamber.

Other and further embodiments of the present disclosure are describedbelow.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present disclosure, briefly summarized above anddiscussed in greater detail below, can be understood by reference to theillustrative embodiments of the disclosure depicted in the appendeddrawings. However, the appended drawings illustrate only typicalembodiments of the disclosure and are therefore not to be consideredlimiting of scope, for the disclosure may admit to other equallyeffective embodiments.

FIG. 1 depicts a schematic view of a processing system having asubstrate transfer apparatus in accordance with some embodiments of thepresent disclosure.

FIG. 2 depicts a cross-sectional view of a substrate transfer apparatusin accordance with some embodiments of the present disclosure.

FIG. 3 depicts a side view of a substrate cassette in accordance withsome embodiments of the present disclosure.

FIG. 4 depicts a top view of a substrate cassette in accordance withsome embodiments of the present disclosure.

FIG. 5 depicts a cross-sectional close up view of a substrate cassettein accordance with some embodiments of the present disclosure.

FIG. 6 depicts an isometric view of a multi-cassette carrying case inaccordance with some embodiments of the present disclosure.

FIG. 7 depicts a cross-section view of the multi-cassette carrying caseof FIG. 6.

FIG. 8 depicts an isometric view of a cassette protector for use withthe substrate cassette carrying apparatus of FIG. 6 in accordance withsome embodiments of the present disclosure.

FIG. 9 depicts a close-up view of the cassette protector of FIG. 8.

FIG. 10 is a flowchart illustrating a method of loading a substrate tobe processed into a substrate cassette in accordance with someembodiments of the present disclosure.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. The figures are not drawn to scale and may be simplifiedfor clarity. Elements and features of one embodiment may be beneficiallyincorporated in other embodiments without further recitation.

DETAILED DESCRIPTION

Embodiments of the present disclosure generally relate to methods andapparatus for transferring a substrate. Embodiments of the inventiveapparatus may include a substrate transfer chamber that advantageouslymounts directly to a load lock chamber of a substrate processing tool,thus minimizing any negative impact on the floor space occupied by thesubstrate processing tool and avoiding unnecessary and costlymodification of existing processing systems. The inventive substratecassette of the present disclosure advantageously allows for thetransport of a substrate in a vacuum, thus avoiding any oxidation thatmay occur on the substrate when moving from a vacuum environment toatmosphere.

FIG. 1 is a schematic top-view diagram of an exemplary multi-chamberprocessing system 100 that may be suitable for use with the presentinventive apparatus disclosed herein. Examples of suitable multi-chamberprocessing systems that may be suitably modified in accordance with theteachings provided herein include the ENDURA®, CENTURA®, and PRODUCER®processing systems or other suitable processing systems commerciallyavailable from Applied Materials, Inc., located in Santa Clara, Calif.Other processing systems (including those from other manufacturers) maybe adapted to benefit from the present disclosure.

In some embodiments, the multi-chamber processing system 100 maygenerally comprise a vacuum-tight processing platform (processingplatform 102), a factory interface 104, and a controller 140. Theprocessing platform 102 may include a plurality of process chambers190A-F and at least one load lock chamber 184 (two shown) that arecoupled to a transfer chamber 188. A substrate transfer robot 106(described below with respect to FIGS. 2 and 3) is centrally disposed inthe transfer chamber 188 to transfer substrates between the load lockchambers 184 and the process chambers 190A-F. The process chambers190A-F may be configured to perform various functions including layerdeposition including atomic layer deposition (ALD), chemical vapordeposition (CVD), physical vapor deposition (PVD), etch, pre-clean,de-gas, orientation and center-finding, annealing, and other substrateprocesses Each of the process chambers 190A-F may include a slit valveor other selectively sealable opening to selectively fluidly couple therespective inner volumes of the process chambers 190A-F to the innervolume of the transfer chamber 188. Similarly, each load lock chamber184 may include a port to selectively fluidly couple the respectiveinner volumes of the load lock chambers 184 to the inner volume of thetransfer chamber 188.

The factory interface 104 is coupled to the transfer chamber 188 via theload lock chambers 184. In some embodiments, each of the load lockchambers 184 may include a first port 123 coupled to the factoryinterface 104 and a second port 125 coupled to the transfer chamber 188.The load lock chambers 184 may be coupled to a pressure control systemwhich pumps down and vents the load lock chambers 184 to facilitatepassing the substrate between the vacuum environment of the transferchamber 188 and the substantially ambient (e.g., atmospheric)environment of the factory interface 104.

In some embodiments, the factory interface 104 comprises at least onedocking station 183 and at least one factory interface robot 185 (oneshown) to facilitate transfer of substrates from the factory interface104 to the processing platform 102 for processing through the load lockchambers 184. The docking station 183 is configured to accept one ormore (four shown) front opening unified pods (FOUPs) 187A-D. Optionally,one or more metrology stations (not shown) may be coupled to the factoryinterface 104 to facilitate measurement of the substrate from the FOUPs187A-D. The factory interface robot 185 disposed in the factoryinterface 104 is capable of linear and rotational movement (arrows 182)to shuttle cassettes of substrates between the load lock chambers 184and the one or more FOUPs 187A-D.

In some embodiments, the inventive substrate transfer chamber 200 isdisposed on a load lock chamber 184 to facilitate transfer of asubstrate to or from the processing platform 102 while keeping thesubstrate in a vacuum atmosphere at all times. The processing platform,and the substrate transfer chamber, may be configured to process andhandle substrates of varying sizes, including round wafers (e.g.,semiconductor wafers) such as 150 mm, 200 mm, 300 mm, 450 mm, or thelike.

FIG. 2 depicts a substrate transfer chamber 200 in accordance with someembodiments of the present disclosure. The substrate transfer chamber200 includes a body 202 that defines an interior volume 204. A bottomportion of the body 202 includes an opening 206 that fluidly couples theinterior volume 204 with the load lock chamber 184. The body 202 furtherincludes a door 208 to allow access to the interior volume 204. In orderto facilitate coupling of the substrate transfer chamber 200 to the loadlock chamber 184, the substrate transfer chamber 200 may include anadapter plate 209 having an opening 203 aligned with the opening 206 tocouple the interior volume 204 of the substrate transfer chamber 200with an inner volume 205 of the load lock chamber 184. The adapter plate209 will very in dimension and configuration depending upon thestructure of the load lock chamber 184 of the specific processingsystem, which advantageously minimizes the cost of retrofitting thesubstrate transfer chamber 200 to existing processing systems. Theadapter plate 209 may be coupled to the substrate transfer chamber 200and the load lock chamber 184 using a plurality of fasteners such as,for example, screws (not shown). The adapter plate 209 includes seals211, 213 (e.g., gaskets, or o-rings) at the interface with the substratetransfer chamber 200 and at the interface with the load lock chamber 184to ensure a proper seal and avoid any vacuum leaks. Similarly, the door208 also includes a seal 207 at the interface between the door and thebody 202. Because the substrate transfer chamber 200 is fluidly coupledto the load lock chamber 184, a vacuum source 230 that evacuates theload lock chamber 184 also evacuates the substrate transfer chamber 200.

The substrate transfer chamber 200 further includes a cassette support210 to support a substrate cassette 300 (described below with respect toFIGS. 3 and 4). In some embodiments, the cassette support 210 includes acollar 212 having protrusions 215 that extend from opposite sides of thecollar 212 to engage a corresponding mounting apparatus 324 on thesubstrate cassette 300 and support the substrate cassette 300 in theinterior volume 204. However, the cassette support 210 may include anytype of device capable of holding onto the substrate cassette 300. Thecassette support 210 further includes a shaft 214 coupling the collar212 to a first end of an arm 216. A lift actuator 218 is coupled to asecond end of the arm 216 to raise and lower the cassette support 210 inthe direction indicated by arrow 217. The cassette support 210 mayinclude any type of actuator capable of raising and lowering thecassette support 210. In some embodiments, for example, the liftactuator 218 may be a linear actuator. The cassette support 210 furtherincludes a locking device 220, which may be coupled to the cassettesupport 210 between the collar 212 and the shaft 214. The locking device220 includes a first piston actuator 221 and a second piston actuator222 on one side of the collar 212 and a protruding element 219 (e.g., ahook) at an opposite side. The first and second piston actuators 221,222 are described below together with the locking plate 308 of thesubstrate cassette 300.

In some embodiments, the substrate transfer chamber 200 may optionallyinclude a seal plate 250 having a shape corresponding to the lowersurface of the substrate transfer chamber 200. The seal plate 250 may beplaced on the lower surface of the chamber to block the opening 206 toallow the multi-chamber processing system 100 and the load lock chamber184 to function normally without use of the substrate transfer chamber200. The seal plate 250 may be secured to the lower surface via anyconventional means such as, for example, screws or the like. A seal maybe disposed between the seal plate 250 and the lower surface of thesubstrate transfer chamber 200 to prevent any vacuum leaks during normaloperation of the load lock chamber 184.

The load lock chamber 184 includes a first opening 232, a second opening234, a pedestal 236, and a lift hoop 238. The first opening 232facilitates interfacing with the docking station 183 to allow thefactory interface robot 185 to insert or remove a substrate from theload lock chamber 184. The second opening 234 facilitates interfacingwith the processing platform 102 to allow the substrate transfer robot106 to insert or remove a substrate from the load lock chamber 184. Asshown in FIG. 2, the first and second openings 232, 234 may bevertically offset so that the lift hoop is raised to receive/supply asubstrate from/to the factory interface robot 185 and lowered toreceive/supply a substrate from/to the substrate transfer robot 106. Alift actuator 240 is coupled to the lift hoop 238 to raise or lower thelift hoop 238.

FIG. 3 depicts a side view a substrate cassette 300 in accordance withsome embodiments of the present disclosure. FIG. 4 depicts a top view ofthe substrate cassette 300 attached to the cassette support 210 of thesubstrate transfer chamber 200. The substrate cassette 300 includes anupper portion 302 and a lower portion 304 which, when coupled, define aninterior volume 505 (shown in FIG. 5). The substrate cassette 300 alsoincludes a locking mechanism 306, which couples the upper portion 302 tothe lower portion 304, and a mounting apparatus 324 having prongs 325and a latch 323. The mounting apparatus 324 is shaped so that theprotrusions 215 of the collar 212 are inserted into a space 327 betweenthe prongs 325, which rest on the protrusions 215 to support thesubstrate cassette 300. As the substrate cassette 300 is moved furtherinto the interior volume 204, the protrusions 215 move further into thespace 327 and the latch 323 approaches the protruding element 219. Thesubstrate cassette 300 is pushed until the latch 323 latches onto theprotruding element 219, thus locking the substrate cassette 300 in placeand allowing the substrate cassette 300 to hang on the cassette support210.

The locking mechanism 306 may include a locking plate 308 disposed onthe upper portion 302 and having a plurality of arms 310 extending froma center of the locking plate 308. Two of the plurality of arms 310include upwardly extending tabs 312 that are perpendicular to thelocking plate 308. A plurality of locking pins 313 extend through endsof the plurality of arms 310 and into a corresponding plurality of slots314 formed in both the upper portion 302 and the lower portion 304. Eachof the plurality of locking pins 313 includes a reduced diametermidsection whose diameter is less than a width of each slot 314 to allowthe locking pin 313 to slide along the slot 314. Both ends of eachlocking pin 313 have a diameter that is greater than a width of the slotto prevent the locking pin 313 from passing through the slot 314. Eachof the plurality of slots 314 includes an elongated portion 316 and ahole 318 at one end of the elongated portion 316. A thickness of theelongated portion 316 is less than a diameter of the hole 318.

In a locked position (e.g., when the upper portion 302 and the lowerportion 304 are coupled), each locking pin 313 extends through theelongated portion 316. Because the ends of the locking pins 313 are toolarge to pass through the elongated portion 316, the upper portion 302and the lower portion 304 are sandwiched together between the enlargedends. In an unlocked position, each locking pin 313 extends through thehole 318. The ends of the locking pin 313 are sized to allow the lockingpin 313 to pass through the holes 318. When each locking pin 313 extendsthrough the hole 318, the upper and lower portions 302, 304 can beseparated. To ensure that the locking plate 308 remains coupled to theupper portion 302, each of the plurality of arms 310 includes aprotrusion 320 that extends beneath a corresponding tab 322 formed onthe upper portion 302. As shown in FIG. 4, the protrusions 320 aresubstantially perpendicular to the arms 310.

Referring to FIG. 4, the locking device 220 includes a first pistonactuator 221 and a second piston actuator 222 perpendicular to the firstpiston actuator 221. The first and second piston actuators 221, 222 areeach disposed adjacent to one of the upwardly extending tabs 312 to pushthe upwardly extending tabs 312 and move the locking mechanism 306 in afirst direction and a second direction opposite the first direction(e.g., between the locked and unlocked positions). In some embodiments,the first and second piston actuators 221, 222 may be actuated usingsoftware.

In some embodiments, the upper portion 302 may include a loaddistribution plate 326 coupled to an upper surface of the upper portion302 to evenly distribute a downwardly projecting force by the cassettesupport 210 pressing the upper portion 302 against the lower portion 304for coupling. The load distribution plate 326 is coupled to the upperportion 302 via a plurality of fastening elements 330 (e.g., bolts,screws, or the like). In some embodiments, the upper portion 302 mayfurther include a plurality of locating pins 328 to interface with acorresponding plurality of holes in the lower portion 304 to correctlyalign the upper and lower portions 302, 304 during coupling.

FIG. 5 depicts a close up cross-sectional view of the substrate cassette300 containing a substrate 502. The substrate 502 rests on an innersurface 508 of the lower portion 304. In some embodiments, the innersurface may be shaped so that the number of contact points between thesubstrate 502 and the inner surface 508 is minimal to prevent any damageto a backside of the substrate 502. For example, the number of contactpoints may be limited to four contact points. In, some embodiments, theupper portion 302 may include an annular ring 510 proximate a peripheryof the substrate 502 to limit or substantially eliminate any movement ofthe substrate 502 during transport. The upper and lower portions 302,304 may be formed of any material that will not damage the substrate502. For example, in some embodiments the upper and lower portions 302,304 are formed of polyether ether ketone (PEEK). The lower portion 304may include a seal 504 (e.g., gasket, o-ring, or the like) around aperiphery of the lower portion at the interface between the lowerportion 304 and the upper portion 302. The seal 504 prevents any vacuumleaks when the substrate cassette 300 is removed from the vacuumenvironment inside of the substrate transfer chamber 200. The seal 504is formed of a material that is non-sticky, vacuum-compatible materialto ensure that the separation of the upper and lower portions 302, 304does not damage the seal 504.

As shown in FIG. 5, the lower portion 304 includes a recessed section506 through which the substrate transfer robot 106 can extend to liftthe substrate 502 after the upper portion 302 has been separated fromthe lower portion 304.

In operation, the substrate cassette 300 is inserted onto the collar 212of the substrate transfer chamber 200. When the door 208 is closed, thevacuum source 230 coupled to the load lock chamber 184 evacuates theinterior volume 204 and the inner volume 205. The lift actuator 218 thenlowers the substrate cassette 300 onto one of the lift hoop 238 (if thelift hoop 238 is raised) or the pedestal 236 (if the lift hoop 238 islowered). If the substrate cassette 300 is lowered onto the raised lifthoop 238, the lift hoop 238 is lowered until the substrate cassette 300rests on the pedestal 236. The locking device 220 is subsequentlyactivated to rotate the locking mechanism 306 towards the unlockedposition. Next, the lift actuator 218 lifts the upper portion 302 up,leaving the lower portion 304 resting on the pedestal 236. A substrate502 is either placed in or removed from the substrate cassette 300.Subsequently, the lift actuator 218 lowers the upper portion 302 ontothe lower portion 304 and forces the two portions together. The loaddistribution plate 326 ensures that the force is evenly distributedabout the substrate cassette 300. The locking device 220 then rotatesthe locking mechanism towards the locked position, thus locking theupper and lower portions 302, 304 together. After the interior volume204 and the inner volume 205 return to atmosphere, the lift actuator 218lifts the substrate cassette 300 back up into the substrate transferchamber 200 for removal.

FIGS. 6 and 7 depict a multi-cassette carrying case 600 in accordancewith some embodiments of the present disclosure. The multi-cassettecarrying case 600 includes a body 602 that defines an inner volume 704and has an opening 606. At least one handle 614 may be disposed on anouter surface of the body 602 to enable carrying of the multi-cassettecarrying case 600. The multi-cassette carrying case 600 further includesa door 608 that is placed in the opening 606 to seal off the innervolume 704. Although in FIG. 6 the door 608 is shown as fullydetachable, the door 608 may alternatively be attached to a side of thebody 602 via a hinge assembly. The door 608 includes locking mechanisms610 that facilitate locking the door 608 in the opening 606. The lockingmechanisms 610 may include any locking mechanisms suitable to fix thedoor 608 shut.

The multi-cassette carrying case 600 further includes a plurality ofcassette holders to hold one or more substrate cassettes 300. Thecassette holders include a plurality of ledges 612 on opposite sides ofthe inner volume 704 to support one or more substrate cassettes 300. Toensure that the substrate cassettes 300 do not move during transport,the plurality of cassette holders may further include a plurality ofsnap locks 702 disposed at a rear portion of the inner volume 704. Toplace a substrate cassette 300 in the multi-cassette carrying case 600,the substrate cassette 300 is placed on a set of ledges 612 and pushedtowards the corresponding snap lock 702. When the substrate cassette 300contacts the snap lock 702, the substrate cassette 300 is pushed furtherso that the snap lock 702 deforms outwardly and subsequently latchesonto the substrate cassette 300, thus locking the substrate cassette 300in place.

In some embodiments, the multi-cassette carrying case 600 may include avacuum port 616 and a vent port 618 to allow coupling of themulti-cassette carrying case to a vacuum source. In embodiments in whichthe inner volume 704 of the multi-cassette carrying case 600 isevacuated, the door 608 may include a seal around the periphery of thedoor to prevent any vacuum leaks during transport. In some embodiments,the multi-cassette carrying case 600 may also include a pressuremonitoring device 620 to monitor and display a pressure of the innervolume 704. Alternatively or in combination, the vacuum port 616, ventport 618, or another port (not shown), may be coupled to a gas source,for example an inert gas source, to provide an inert gas to the interiorof the multi-cassette carrying case.

FIGS. 8 and 9 depict a cassette protector 800 in accordance with someembodiments of the disclosure. In some embodiments, the cassetteprotector 800 may be used in combination with the multi-cassettecarrying case 600 to provide added protection to the substrate cassette300. The cassette protector 800 includes a plate 802 having a pluralityof arms 803. Each of the plurality of arms 803 includes an upwardlyprojecting edge 805. A plurality of bumpers 804 are respectivelydisposed on inner surfaces of the upwardly projecting edges 805. Thedistance from a first bumper 804 to a second bumper 804 disposed acrossfrom the first bumper 804 is approximately equal to a diameter of thesubstrate cassette 300. Each of the projecting edges 805 includes alatching apparatus 806 having a latch 808 and a latch handle 810 tosecure the cassette protector to a substrate cassette.

Referring to FIG. 9, a plurality of latch plates 902 corresponding tothe plurality of arms 803 are coupled to the upper portion 302 of thesubstrate cassette 300 via fixation elements 904. The latch plate 902includes a hook 906 which, when the substrate cassette 300 is placed inthe cassette protector 800, is disposed adjacent the latch 808. Toengage the latch 808, the latch handle 810 is lifted, the latch 808 isplaced on the hook 906, and the latch handle 810 is pushed down again,thus coupling the cassette protector 800 to the substrate cassette 300.

FIG. 10 is a flowchart illustrating a method 1000 of loading a substrate502 to be processed into a substrate cassette 300 in accordance withsome embodiments of the present disclosure. At 1005, a volume (interiorvolume 204) in which the substrate cassette 300 is disposed isevacuated. At 1010, a locking mechanism 306 of the substrate cassette300 is unlocked to uncouple an upper portion 302 from a lower portion304 of the substrate cassette 300. At 1015, the upper portion 302 isseparated from the lower portion 304. At 1020, the substrate 502 isplaced on an inner surface 508 of the lower portion 304. At 1025, theupper portion 302 is forced against the lower portion 304. At 1030, thelocking mechanism 306 is locked to couple the upper portion 302 to thelower portion 304. Thus, the substrate may be disposed in the substratecassette 300 in a vacuum environment while located outside of the vacuumprocessing tool.

Returning to FIG. 1, the controller 140 may be provided and coupled tovarious components of the multi-chamber processing system 100 to controlthe operation of the multi-chamber processing system 100. The controller140 includes a central processing unit (CPU) 142, a memory 144, andsupport circuits 146. The controller 140 may control the multi-chamberprocessing system 100 directly, or via computers (or controllers)associated with particular process chamber and/or support systemcomponents. The controller 140 may be any form of general-purposecomputer processor that can be used in an industrial setting forcontrolling various chambers and sub-processors. The memory, or computerreadable medium, 144 of the controller 140 may be one or more of readilyavailable memory such as random access memory (RAM), read only memory(ROM), floppy disk, hard disk, optical storage media (e.g., compact discor digital video disc), flash drive, or any other form of digitalstorage, local or remote. The support circuits 146 are coupled to theCPU 142 for supporting the processor in a conventional manner. Thesecircuits include cache, power supplies, clock circuits, input/outputcircuitry and subsystems, and the like. Inventive methods as describedherein, such as the method 1000, may be stored in the memory 144 assoftware routine that may be executed or invoked to control theoperation of the multi-chamber processing system 100 in the mannerdescribed herein. The software routine may also be stored and/orexecuted by a second CPU (not shown) that is remotely located from thehardware being controlled by the CPU 142.

While the foregoing is directed to embodiments of the presentdisclosure, other and further embodiments of the disclosure may bedevised without departing from the basic scope thereof.

1. An apparatus for storing and transporting at least one substrate in avacuum, comprising: a carrying case for storing one or more substrates,wherein the carrying case includes a vacuum port and a plurality ofholders to hold one or more substrates within an inner volume of thecarrying case; and a vacuum source in fluid connection with the carryingcase via the vacuum port.
 2. The apparatus of claim 1, wherein thecarrying case includes a door to seal off the inner volume.
 3. Theapparatus of claim 2, wherein the door is fully detachable.
 4. Theapparatus of claim 1, wherein the carrying case includes a door toprovide access to the inner volume.
 5. The apparatus of claim 1, whereinthe carrying case includes a pressure monitoring device to monitor apressure of the inner volume.
 6. The apparatus of claim 1, furthercomprising an inert gas source to provide an inert gas to the innervolume.
 7. The apparatus of claim 1, further comprising a handledisposed on an outer surface of the carrying case.
 8. The apparatus ofclaim 1, wherein the plurality of holders include a plurality of ledgeson opposite sides of the inner volume to support one or more substrates.9. The apparatus of claim 1, wherein the carrying case includes a ventport.
 10. An apparatus for storing and transporting at least onesubstrate in a vacuum, comprising: a substrate cassette having asubstrate support for storing a substrate within an interior volume ofthe substrate cassette; and a vacuum source selectively in fluidconnection with the substrate cassette.
 11. The apparatus of claim 10,wherein the substrate cassette includes an upper portion and a lowerportion, when coupled, define the interior volume.
 12. The apparatus ofclaim 11, wherein the upper portion is fully detachable from a lowerportion of the substrate cassette.
 13. The apparatus of claim 11,wherein the upper portion and the lower portion include a lockingmechanism configured to lock the upper portion to the lower portion whenthe upper portion is rotated with respect to the lower portion.
 14. Theapparatus of claim 13, wherein the locking mechanism includes a lockingplate disposed on the upper portion and having a plurality of armsextending from a center of the locking plate, wherein the plurality ofarms include upwardly extending tabs.
 15. The apparatus of claim 14,where the locking mechanism further comprises: a plurality of lockingpins extending through ends of the plurality of arms and into acorresponding plurality of slots formed in both the upper portion andthe lower portion.
 16. The apparatus of claim 15, wherein each of thecorresponding plurality of slots includes an elongated portion and ahole at one end of the elongated portion.
 17. The apparatus of claim 11,wherein the upper portion includes a load distribution plate to evenlydistribute downward force against the lower portion.
 18. The apparatusof claim 11, wherein the upper portion is configured to provide thesubstrate into or out of the interior volume.
 19. The apparatus of claim11, wherein the upper portion includes a plurality of locating pinscorresponding with a plurality of holes in the lower portion.
 20. Theapparatus of claim 10, wherein the substrate cassette includes amounting apparatus having prongs and a latch.